取消
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ATS-NVA-2780-C1-R0 | Advanced Thermal Solutions | - |
850
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散热片 High Performance Active Heat Sink for NVIDA Jetson Nano Module, 60x40x8mm, T766 | 180.6983 | ||
|
ATS-NVP-3275-C3-R0 | Advanced Thermal Solutions | - |
840
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散热片 Heat Sink for NVIDA Jetson AGX Xavier/AGX Orin Modules, 60x40x8mm, T412 | 320.4793 | ||
|
ATS-NVP-2781-C2-R0 | Advanced Thermal Solutions | - |
850
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散热片 High Performance Heat Sink for NVIDA Jetson Xavier NX Module, 60x40x8mm, T766 | 139.9392 | ||
|
40519 | Vicor | - |
963
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散热片 4623 HS Dual Long 11 mm | 475.956 | ||
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29063 | Auvidea | - |
3773
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散热片 Heatsink for NVIDIA Jetson Nano | 32.544 | ||
|
HSS-B20-NP | CUI Devices | - |
3934
|
散热片 38.1 x 12.8 x 12.7mm TO-220 slide in | 6.1811 | ||
|
HS13 | Apex Microtechnology | - |
896
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散热片 Heatsink, T03 | 983.9701 | ||
|
HSS-B20-0508H-01R | CUI Devices | - |
4565
|
散热片 29.97 x 25.4 x12.7mm TO-220 bolt on/pin | 5.2884 | ||
|
29062 | Auvidea | - |
1502
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散热片 Heatspreader for NVIDIA Jetson Nano | 43.9344 | ||
|
34009-0000-99-2 | Kontron | - |
850
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散热片 HSP COMe-mAL10 E2 slim thread | 213.57 | ||
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6022BG | Aavid | - |
4862
|
散热片 Space-Saving Heat Sink, TO220, Stagger, Vertical, 16.7 Degree C/W, 2.36mm Hole | 26.3629 | ||
|
70752 | Auvidea | - |
814
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散热片 Heatsink for NVIDIA Jetson Nano black aluminum heatsink and fan for the Jetson Nano | 50.1155 | ||
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HSIB919-1 | IBASE | - |
804
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散热片 AC, Heat Spreader for IB919 series, (RoHS) , H051xxxxxxxx | 335.2032 | ||
|
40482 | Vicor | - |
806
|
散热片 4623 HS Top Tran 11 mm | 203.1514 | ||
|
LEC-IMX6-HS | ADLINK Technology | - |
810
|
散热片 LEC-iMX6-HSHeatspreader for LEC-iMX6 Quad/Dual | 198.1116 | ||
|
HSIB811-I | IBASE | - |
802
|
散热片 Heatsink for IB811-I30 and IB811-I50 | 384.0983 | ||
|
|
38030-0000-99-0 | Kontron | - |
885
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散热片 HSP COMe-bSL6 Cu-core threaded | 345.78 | ||
|
114992686 | Seeed Studio | - |
994
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散热片 Jetson Nano Module Heatsink | 86.3998 | ||
|
ATS-HK379-R0 | Advanced Thermal Solutions | - |
1512
|
散热片 Cooler Backing Plate, 96x96 LxW, 80mm Hole-Hole, 6mm Standoff Height, AI | 27.007 | ||
|
HSE05-171933 | CUI Devices | - |
2251
|
散热片 heat sink, extrusion, TO-218/TO-220, 17 x 19.4 x 32.5 mm | 11.4695 | ||
|
HSE02-173213 | CUI Devices | - |
2300
|
散热片 heat sink, extrusion, 17 x 31.9 x 12.5 mm | 11.4695 | ||
|
81004-0000-99-1 | Kontron | - |
813
|
散热片 HSP-Qseven-Q7AL2 | 132.21 | ||
|
HSS14-B20-NP | CUI Devices | - |
6608
|
散热片 heat sink, stamping, TO-220, 19.05 x 24. | 6.5088 | ||
|
HSB05-171711 | CUI Devices | - |
2799
|
散热片 heat sink, BGA, 17 x 17 x 11.5 mm | 8.7914 | ||
|
1960092232T000 | Advantech | - |
803
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散热片 VEGA 330 Standard heatsink | 75.823 |
