取消
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RS9113-NB0-D0N | REDPINE | - | Tray |
801
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WLAN and Bluetooth Wireless Combo Module | 24.3455 | |
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ENW-F9208A1EF | PANASONIC | - | Tape and Reel |
1800
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WLAN+BT Wireless Combo Module | 17.439 | |
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102110419 | SEEED DEVELOPMENT LIMITED | - |
1871
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WiFi and Bluetooth Module that Dual Bands for WiFi Communication | 4.362 | ||
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EC.20N | TAOGLAS LTD | - |
810
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EDGE Connect - Instant IOT Device with On-Board Sensors, Management Platform and NB-IOT Connectivity | 158.66 | ||
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IW416HN/A1CMP | NXP SEMICONDUCTORS | - |
2800
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Dual-band 1x1 Wi-Fi 4 and Bluetooth 5.1 Combo SoC | 6.0237 | ||
|
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9260.NGWGIE.NVK99AC9M | INTEL | - |
850
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9260.NGWGIE.NVK99AC9M | 39.951 | ||
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ATWILC3000-MR110CA | MICROCHIP TECHNOLOGY | - | Tray |
901
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WLAN+BTCombo Module Chip IEEE 802.11b/g/n Bluetooth v4.0(BLE) Class I/Class II | 13.4 | |
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450-0159R | LAIRD TECHNOLOGIES | - | Tape and Reel |
1800
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WLAN+BTCombo Module IEEE 802.11b/g/n Bluetooth v2.1 + EDR/Bluetooth v3.0/Bluetooth v4.1(BLE) Class II 151-Pin | 17.55 | |
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CYW4343WKWBGT | CYPRESS SEMICONDUCTOR | - | Tape and Reel |
5800
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Single-Chip 802.11 b/g/n MAC/Baseband/Radio with Bluetooth 4.1 | 4.7173 | |
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MGM13S12F512GN-V2 | SILICON LABS | - | Tray |
1000
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EFR32MG13 Mesh SiP Module, 2.4GHz, 512kB Flash, +18 dBm, External Antenna | 14.1287 | |
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SN10-22 | Innocom Mobile Technology Corp. | - | Tray |
814
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SIGFOX plus BLE/WiFi/GPS Combo Module for Zone 2 / Zone 4 | 13.0893 | |
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STM32WB55CCU6 | STMICROELECTRONICS | - | Tray |
2360
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Bluetooth v5.0 and 802.15.4 With Microcontroller Combo module | 6.262 | |
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CC1350F128RSMT | NATIONAL SEMICONDUCTOR | - |
806
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wireless MCU targeting Bluetooth, ZigBee remote control applications | 6.783 | ||
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LBEE5XV1YM-574 | MURATA MANUFACTURING | - |
1900
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WAN and Bluetooth Combo Module | 18.2927 | ||
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CC1310F32RGZT | TEXAS INSTRUMENTS | - | 2.5/3.3(V) |
832
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Cost-effective, ultra-low-power Wi-Fi, Bluetooth® low energy, Sub-1 GHz, Ethernet, Zigbee, Thread, and host MCU | 3.222 | |
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CC1350F128RGZT | NATIONAL SEMICONDUCTOR | - |
879
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wireless MCU targeting Bluetooth, ZigBee remote control applications | 6.992 | ||
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WYSBHVGXG | TAIYO YUDEN | - | Tape and Reel |
884
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Wireless LAN and Bluetooth Module | 17.97 | |
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ST60-SIPT-C | LAIRD TECHNOLOGIES | - | Tape and Reel |
900
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WLAN+BTCombo Module IEEE 802.11a/b/g/n/ac Bluetooth v4.2(BLE) + EDR Class I 84-Pin LGA | 42.0244 | |
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WFI32E01PE-I | MICROCHIP TECHNOLOGY | - |
977
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Standalone Wi-Fi MCU Module | 11.91 | ||
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88W8977-A1-EADE/AZ | NXP SEMICONDUCTORS | - |
3800
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WLAN/Bluetooth/NFC/FM Receive Single-Chip SoC | 6.6263 | ||
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ATWINC3400-MR210CA131 | MICROCHIP TECHNOLOGY | - |
817
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IEEE 802.11 b/g/n Network Controller with Integrated Bluetooth Low Energy Module | 12.28 | ||
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LBEE5KL1DX-883 | MURATA MANUFACTURING | - | Tape and Reel |
6800
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Wi-Fi Enabled IEEE 802.11 b/g/n + Bluetooth 4.1 | 9.7561 | |
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ATWINC3400-MR210CA122 | MICROCHIP TECHNOLOGY | - | Tray |
1494
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WLAN+BTCombo Module IEEE 802.11b/g/n Bluetooth v4.0(BLE) Class I/Class II 36-Pin | 15.6001 | |
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ATWILC3000-MR110UA | MICROCHIP TECHNOLOGY | - | Tray |
909
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WLAN+BTCombo Module Chip IEEE 802.11b/g/n Bluetooth v4.0(BLE) Class I/Class II | 11.597 | |
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RS9116W-SB00-QMS-B24 | SILICON LABS | - |
3389
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WLAN and Bluetooth Combo System on Chip | 10.9411 |
