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AGFB027R24C2I1VB

Part number AGFB027R24C2I1VB
Product classification System On Chip (SoC)
Manufacturer Intel
Description IC
Encapsulation
Packing Tray
Quantity 0
RoHS status NO
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$35,967.7500

$107,903.2500

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Product parameters
TYPEDESCRIPTION
MfrIntel
SeriesAgilex F
PackageTray
Product StatusACTIVE
Package / Case2340-BFBGA Exposed Pad
Speed1.4GHz
RAM Size256KB
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary AttributesFPGA - 2.7M Logic Elements
ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package2340-BGA (45x42)
ArchitectureMPU, FPGA

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FIBOX Enclosures
Inspection Window 5.12 x 3.03 x
COILCRAFT
FIXED IND 9.9NH 1.4A 73MOHM SM
Remington Industries
HEATSHRINK 3:1 PO 1" X 4' RED
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