13798512084
取消

AGFC023R24C2E1V

Part number AGFC023R24C2E1V
Product classification System On Chip (SoC)
Manufacturer Intel
Description IC
Encapsulation
Packing Tray
Quantity 0
RoHS status NO
Share
Inventory:
Total number

Quantity

Price

Total price

3

$26,135.7390

$78,407.2170

Obtain quotation information
Product parameters
TYPEDESCRIPTION
MfrIntel
SeriesAgilex F
PackageTray
Product StatusACTIVE
Package / Case2340-BFBGA Exposed Pad
Speed1.4GHz
RAM Size256KB
Operating Temperature0°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary AttributesFPGA - 2.3M Logic Elements
ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package2340-BGA (45x42)
ArchitectureMPU, FPGA

Littelfuse / Carling Technologies
Gamma Electronics
Our fray resistant expandable sl
Hoffmann Group
WRENCH COMBO 27MM 9.803"
Boundary Devices
SBC 2.2GHZ 2/6 CORE 8GB/0GB RAM
GlobTek, Inc.
INLINE USBC 3.1 EXTENSION CORD 2
Top Shelf Acoustics
Uni (Cardioid) Microphone
Polymer Optics Ltd.
CONCENTRATOR IN REBEL HOLDER
SKB Corporation
ISERIES MIL-SPEC PISTOL CASE, WA
Interion By Global Industrial
MOB. DLX PARTITION PANEL WINDOW
关闭
Inquiry
captcha

13798512085

点击这里给我发消息 点击这里给我发消息
0