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SG3-1.0

  • SG3-1.0
  • SG3-1.0
SG3-1.0
Adhesives Materials
Chip Quik Inc.
SG3-1.0 datashe
-
-
16469
YES
TYPEDESCRIPTION
Factory Lead Time 4 Weeks
Series CHIPQUIK®
Feature Fast Cure, 30mL
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Adhesive
Shelf Life 24 Months
Storage/Refrigeration Temperature 37°F~77°F 3°C~25°C
RoHS Status ROHS3 Compliant

Laird Technologies - Thermal Materials
A17170-01 datasheet pdf and Thermal - Adhesives, Epoxies, Greases, Pastes product details from Laird Technologies - Thermal Materials stock available at Utmel
Chip Quik Inc.
SG3-1.0 datasheet pdf and Glue, Adhesives, Applicators product details from Chip Quik Inc. stock available at Utmel
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