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101022-501

Part number 101022-501
Product classification Glue, Adhesives, Applicators
Manufacturer Resin Formulators
Description RF 1366 Low viscosity general pu
Encapsulation
Packing Pail
Quantity 3
RoHS status NO
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$438.0180

$438.0180

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TYPEDESCRIPTION
MfrResin Formulators
Series-
PackagePail
Product StatusACTIVE
Features5 Gallon
TypeResin

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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