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31845

Part number 31845
Product classification Chemicals, Cleaners
Manufacturer 3M
Description BONDO PROF HIGH BOND FIL 1 QUART
Encapsulation
Packing Bulk
Quantity 0
RoHS status YES
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Inventory:
Total number

Quantity

Price

Total price

1

$21.7770

$21.7770

12

$20.6850

$248.2200

36

$19.5930

$705.3480

60

$18.5115

$1,110.6900

108

$17.4195

$1,881.3060

252

$16.3275

$4,114.5300

504

$15.2460

$7,683.9840

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Product parameters
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TYPEDESCRIPTION
Mfr3M
SeriesBondo®
PackageBulk
Product StatusDISCONTINUED
TypeFiller, Body
Size1 qt
ApplicationsGeneral Purpose

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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