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371924B00032G

Part number 371924B00032G
Product classification Heat Sinks
Manufacturer Nuventix (BOYD)
Description 371924B00032G
Encapsulation
Packing Bulk
Quantity 0
RoHS status NO
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Price

Total price

298

$2.4990

$744.7020

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Product parameters
TYPEDESCRIPTION
MfrNuventix (BOYD)
Series-
PackageBulk
Product StatusACTIVE
MaterialAluminum
Length1.378" (35.00mm)
ShapeSquare, Pin Fins
TypeTop Mount
Width1.378" (35.00mm)
Package CooledBGA, FPGA
Attachment MethodThermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise3.0W @ 60°C
Thermal Resistance @ Forced Air Flow6.00°C/W @ 200 LFM
Thermal Resistance @ Natural31.90°C/W
Fin Height0.551" (14.00mm)
Material FinishBlack Anodized

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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