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386824

Part number 386824
Product classification Solder
Manufacturer Harimatec
Description 60/40 370 3% .024DIA 22AWG
Encapsulation
Packing Bulk
Quantity 60
RoHS status NO
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Inventory:
Total number

Quantity

Price

Total price

1

$63.2730

$63.2730

5

$58.0020

$290.0100

10

$50.0955

$500.9550

40

$42.1785

$1,687.1400

80

$39.5430

$3,163.4400

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Product parameters
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TYPEDESCRIPTION
MfrHarimatec
Series370
PackageBulk
Product StatusACTIVE
Diameter0.024" (0.61mm)
Wire Gauge22 AWG, 23 SWG
CompositionSn60Pb40 (60/40)
TypeWire Solder
Melting Point361 ~ 374°F (183 ~ 190°C)
FormSpool, 17.64 oz (500g)
ProcessLeaded
Flux TypeRosin Activated (RA)

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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