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415-023-000-122

Part number 415-023-000-122
Product classification Card Edge Connector Housings
Manufacturer EDAC Inc.
Description 415 SERIES METAL TO METAL 2 PIEC
Encapsulation
Packing Tray
Quantity 0
RoHS status YES
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25

$9.1035

$227.5875

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Product parameters
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TYPEDESCRIPTION
MfrEDAC Inc.
Series415
PackageTray
Product StatusACTIVE
ColorGreen
Pitch0.200" (5.08mm)
Operating Temperature-65°C ~ 125°C
Card TypeNon Specified - Dual Edge
Card Thickness0.093" (2.36mm)
Flange FeatureTop Mount Opening, Unthreaded, 0.128" (3.25mm) Dia
Material - InsulationDiallyl Phthalate (DAP)
Material Flammability RatingUL94 V-0
NoteContacts Not Included
Number of Positions23

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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