86-13826519287‬
取消

6882604

Part number 6882604
Product classification Embedded Computer Accessories
Manufacturer Diamond Systems
Description HEAT SINK FOR FLOYD NANO / NX
Encapsulation
Packing Bulk
Quantity 7
RoHS status YES
Share
Inventory:
Total number

Quantity

Price

Total price

1

$37.8000

$37.8000

5

$34.6500

$173.2500

Obtain quotation information
Product parameters
TYPEDESCRIPTION
MfrDiamond Systems
SeriesFLOYD
PackageBulk
Product StatusACTIVE
Accessory TypeHeat Sink
Specifications100mm x 50mm

Cinch Connectivity Solutions Johnson
CONN TIP JACK TURRET GREEN
Panasonic Electronic Components
CAP TANT 4.7UF 20% 50V RADIAL
Wickmann / Littelfuse
FUSE CLIP CARTRIDGE 250V 15A PCB
Wickmann / Littelfuse
SCR 200V 8A TO220
Cinch Connectivity Solutions Johnson
CONN BANANA JACK SLDR TABS YLW
3M
CONN HEADER VERT 72POS 2.54MM
Wickmann / Littelfuse
FUSE GLASS 1.5A 250VAC 3AB 3AG
Wickmann / Littelfuse
FUSE GLASS 750MA 250VAC 3AB 3AG
关闭
Inquiry
captcha

86-13826519287‬
0