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A-WBP-L006EA-13TB01

Part number A-WBP-L006EA-13TB01
Product classification Headers, Male Pins
Manufacturer ASSMANN WSW Components
Description WIRE-TO-BOARD, WAFER, 2.50MM, 13
Encapsulation
Packing Bag
Quantity 0
RoHS status YES
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Total number

Quantity

Price

Total price

5000

$0.2940

$1,470.0000

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Product parameters
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TYPEDESCRIPTION
MfrASSMANN WSW Components
SeriesA-WBP
PackageBag
Product StatusACTIVE
Connector TypeHeader
Voltage Rating250VAC/DC
Current Rating (Amps)3A
Mounting TypeThrough Hole, Right Angle
Number of Positions13
Number of Rows1
StyleBoard to Cable/Wire
Operating Temperature-25°C ~ 85°C
Contact TypeMale Pin
Fastening TypeDetent Lock
Number of Positions LoadedAll
TerminationKinked Pin, Solder
Contact MaterialBrass
Insulation ColorWhite
Pitch - Mating0.098" (2.50mm)
Contact Finish - MatingTin
Contact Finish - PostTin
Contact ShapeSquare
Contact Length - Post0.134" (3.40mm)
Insulation Height0.224" (5.69mm)
ShroudingShrouded - 4 Wall
Insulation MaterialPolyamide (PA66), Nylon 6/6

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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