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AWLP 14/3,2-AS

Part number AWLP 14/3,2-AS
Product classification Board In, Direct Wire to Board
Manufacturer ASSMANN WSW Components
Description DIN 41651, IDC-DIP PLUG, 2.54MM,
Encapsulation
Packing Tray
Quantity 0
RoHS status YES
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Price

Total price

3600

$0.4935

$1,776.6000

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Product parameters
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TYPEDESCRIPTION
MfrASSMANN WSW Components
SeriesAWLP
PackageTray
Product StatusACTIVE
FeaturesFeed Through
Connector TypeRibbon Cable, DIP Header
Contact FinishGold
ColorGray
Mounting TypeThrough Hole
Number of Positions14
Row Spacing0.100" (2.54mm)
Number of Positions LoadedAll
Contact Finish Thickness50.0µin (1.27µm)
Cable TerminationIDC
Cable Pitch0.050" (1.27mm)
Board-Side Pitch0.100" (2.54mm)
Number of Rows2

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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