86-13826519287‬
取消

CC9601031PAG3

Part number CC9601031PAG3
Product classification Solder
Manufacturer Canfield Technologies
Description SAC 305 NO CLEAN 1 LB. .031 DIA
Encapsulation
Packing Spool
Quantity 50
RoHS status YES
Share
Inventory:
Total number

Quantity

Price

Total price

1

$93.8595

$93.8595

Obtain quotation information
Product parameters
TYPEDESCRIPTION
MfrCanfield Technologies
Series-
PackageSpool
Product StatusACTIVE
Diameter0.031" (0.79mm)
Wire Gauge20 AWG, 22 SWG
CompositionSn96.5Ag3Cu0.5 (96.5/3/0.5)
TypeWire Solder
Melting Point423 ~ 424°F (217 ~ 218°C)
FormSpool, 1 lb (453.59g)
ProcessLead Free
Flux TypeNo-Clean
Storage/Refrigeration Temperature50°F ~ 104°F (10°C ~ 40°C)
Shelf Life StartDate of Manufacture
Shelf Life24 Months

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
关闭
Inquiry
captcha

86-13826519287‬
0