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CY7C1315KV18-250BZXI

Part number CY7C1315KV18-250BZXI
Product classification Memory
Manufacturer Spansion (Cypress Semiconductor)
Description IC SRAM 18MBIT PAR 165FBGA
Encapsulation
Packing Tray
Quantity 2728
RoHS status NO
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20

$27.7305

$554.6100

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TYPEDESCRIPTION
MfrSpansion (Cypress Semiconductor)
Series-
PackageTray
Product StatusACTIVE
Package / Case165-LBGA
Mounting TypeSurface Mount
Memory Size18Mbit
Memory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)
Voltage - Supply1.7V ~ 1.9V
TechnologySRAM - Synchronous, QDR II
Clock Frequency250 MHz
Memory FormatSRAM
Supplier Device Package165-FBGA (13x15)
Memory InterfaceParallel
Memory Organization512K x 36
DigiKey ProgrammableNot Verified

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
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MEMS OSC XO 24.5760MHZ CMOS SMD
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MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
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MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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