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D0811PM2FDGUKW-U

Part number D0811PM2FDGUKW-U
Product classification Memory
Manufacturer Kingston Technology
Description itemp 8Gb 200 ball LPD4 3733MHz
Encapsulation
Packing Tray
Quantity 144
RoHS status YES
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Inventory:
Total number

Quantity

Price

Total price

1

$15.0465

$15.0465

10

$11.1195

$111.1950

25

$10.2585

$256.4625

40

$9.9225

$396.9000

80

$9.6495

$771.9600

230

$9.5130

$2,187.9900

440

$9.4080

$4,139.5200

945

$9.2295

$8,721.8775

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Product parameters
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TYPEDESCRIPTION
MfrKingston Technology
Series-
PackageTray
Product StatusACTIVE
Mounting TypeSurface Mount
Memory Size8Gbit
Memory TypeVolatile
Operating Temperature-40°C ~ 95°C
TechnologySDRAM - Mobile LPDDR4
Memory FormatDRAM
Supplier Device Package200-FBGA (10x14.5)
Memory Organization512M x 16

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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