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EVSF100-65

Part number EVSF100-65
Product classification Pads, Sheets
Manufacturer CR Technology
Description Thermal Pad (EverTherm)
Encapsulation
Packing Sheet
Quantity 100
RoHS status YES
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Inventory:
Total number

Quantity

Price

Total price

1

$26.2500

$26.2500

5

$23.1000

$115.5000

10

$21.0000

$210.0000

25

$17.8500

$446.2500

50

$14.7000

$735.0000

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Product parameters
PDF(1)
TYPEDESCRIPTION
MfrCR Technology
SeriesEVSF
PackageSheet
Product StatusACTIVE
ColorWhite
Thickness0.1181" (3.000mm)
TypeGap Filler Pad, Sheet
Thermal Resistivity0.9°C/W
UsageMulti
Outline200.00mm x 300.00mm
Thermal Conductivity1.5W/m-K

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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