86-13826519287‬
取消

EVSF500-65

Part number EVSF500-65
Product classification Pads, Sheets
Manufacturer CR Technology
Description Thermal Pad (EverTherm)
Encapsulation
Packing Sheet
Quantity 100
RoHS status YES
Share
Inventory:
Total number

Quantity

Price

Total price

1

$47.2500

$47.2500

5

$36.7500

$183.7500

10

$31.5000

$315.0000

25

$28.3500

$708.7500

50

$26.2500

$1,312.5000

Obtain quotation information
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrCR Technology
SeriesEVSF
PackageSheet
Product StatusACTIVE
ColorBlue
Thickness0.0394" (1.000mm)
TypeGap Filler Pad, Sheet
Thermal Resistivity0.45°C/W
UsageMulti
Outline200.00mm x 300.00mm
Thermal Conductivity3.0W/m-K

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
关闭
Inquiry
captcha

86-13826519287‬
0