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FGK.1B.110.CZZ

Part number FGK.1B.110.CZZ
Product classification Circular Connector Housings
Manufacturer REDEL / LEMO
Description INTERCONNECT CIRCULAR
Encapsulation
Packing Bulk
Quantity 0
RoHS status NO
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$16.7685

$16.7685

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Product parameters
TYPEDESCRIPTION
MfrREDEL / LEMO
Series1B
PackageBulk
Product StatusACTIVE
FeaturesBackshell
Connector TypeInsert Shell
Mounting TypeFree Hanging (In-Line)
ShieldingShielded
OrientationK
Shell Size - Insert110
Operating Temperature-55°C ~ 250°C
Contact TypeCrimp
Fastening TypePush-Pull
Ingress ProtectionIP50 - Dust Protected
NoteContacts Not Included
Housing ColorSilver
Contact ShapeCircular
Shell MaterialBrass
Shell FinishChrome
Primary MaterialMetal

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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