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FORLINX-OKMX8MM-C+182GSE8GCA10I11

Part number FORLINX-OKMX8MM-C+182GSE8GCA10I11
Product classification Embedded MCU, DSP Evaluation Boards
Manufacturer Forlinx Embedded
Description ARM DEVELOPMENT BOARD,NXP
Encapsulation
Packing Tape & Box (TB)
Quantity 1
RoHS status YES
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$135.4500

$135.4500

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Product parameters
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TYPEDESCRIPTION
MfrForlinx Embedded
Series-
PackageTape & Box (TB)
Product StatusACTIVE
TypeMPU
ContentsBoard(s), Accessories
Core ProcessorARM® Cortex®-A53, Cortex®-M4F
Utilized IC / PartNXP i.MX8MM
PlatformFORLINX-OKMX8MM-C Development Board

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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