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GPEMI1.0-0.060-01-0816

Part number GPEMI1.0-0.060-01-0816
Product classification Pads, Sheets
Manufacturer Henkel / Bergquist
Description THERM PAD 406.4X203.2MM BLACK
Encapsulation
Packing Bulk
Quantity 0
RoHS status YES
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$229.3935

$1,146.9675

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TYPEDESCRIPTION
MfrHenkel / Bergquist
SeriesGap Pad® EMI 1.0
PackageBulk
Product StatusACTIVE
ColorBlack
ShapeRectangular
Thickness0.0600" (1.524mm)
TypeGap Filler Pad, Sheet
Outline406.40mm x 203.20mm
Thermal Conductivity1.0W/m-K
AdhesiveTacky - One Side
Backing, CarrierFiberglass
Shelf Life12 Months

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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