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HBA25031-10/CU/Y

Part number HBA25031-10/CU/Y
Product classification Heat Sinks
Manufacturer Malico
Description CU HEAT SINK 25X25X10MM WITH LIN
Encapsulation
Packing Tray
Quantity 78
RoHS status YES
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Inventory:
Total number

Quantity

Price

Total price

1

$5.4390

$5.4390

10

$5.3025

$53.0250

25

$5.1555

$128.8875

50

$4.8720

$243.6000

100

$4.5780

$457.8000

250

$4.2945

$1,073.6250

450

$4.1475

$1,866.3750

950

$3.7275

$3,541.1250

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Product parameters
TYPEDESCRIPTION
MfrMalico
SeriesHBA
PackageTray
Product StatusACTIVE
MaterialCopper
Length0.984" (25.00mm)
ShapeSquare, Fins
TypeTop Mount
Width0.984" (25.00mm)
Package CooledBGA
Attachment MethodClip
Fin Height0.307" (7.80mm)

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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