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HFA2.00CL100

Part number： HFA2.00CL100
Product classification： Tape
Manufacturer： Techflex
Description： TAPE HOT FUSION 1.97"X 33.3YD
Encapsulation：
Packing： Spool
Quantity： 0
RoHS status： YES
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$165.4380

$165.4380

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TYPEDESCRIPTION
MfrTechflex
SeriesShrinkflex®
PackageSpool
Product StatusACTIVE
ColorClear
Length100' (30.5m) 33.3 yds
Thickness0.0120" (12.0 mils, 0.305mm)
Tape TypeHot Fusion
Width1.97" (50.00mm)
UsageSealing

Roving Networks (Microchip Technology)
DSC1001DI1-133.0000T
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
DSC1001BL5-024.5760T
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
DSC1122BI1-100.0000T
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
DSC1122AI1-125.0000T
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
DSC6001JE1B-052.0000T
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
DSC1001BI5-133.3330T
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
DSC1123CI2-175.0000T
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
DSC1123DI1-125.0000T
MEMS OSC LOW JITTER 125MHZ LVDS
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