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HS-MA3-R1-SET-R1

Part number HS-MA3-R1-SET-R1
Product classification Heat Sinks
Manufacturer Enclustra
Description HEATSINK MARS MA3
Encapsulation
Packing Bag
Quantity 0
RoHS status NO
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Product parameters
TYPEDESCRIPTION
MfrEnclustra
SeriesMars MA3
PackageBag
Product StatusOBSOLETE
TypeTop Mount
Package CooledFPGA

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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