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HSB19-272718

Part number HSB19-272718
Product classification Heat Sinks
Manufacturer CUI Devices
Description HEAT SINK, BGA, 27 X 27 X 18 MM
Encapsulation
Packing Box
Quantity 20
RoHS status YES
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Inventory:
Total number

Quantity

Price

Total price

1

$2.0265

$2.0265

10

$1.9215

$19.2150

25

$1.8690

$46.7250

50

$1.8165

$90.8250

100

$1.7220

$172.2000

250

$1.6170

$404.2500

500

$1.5120

$756.0000

1000

$1.4175

$1,417.5000

5000

$1.3650

$6,825.0000

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Product parameters
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TYPEDESCRIPTION
MfrCUI Devices
SeriesHSB
PackageBox
Product StatusACTIVE
MaterialAluminum Alloy
Length1.063" (27.00mm)
ShapeSquare, Pin Fins
TypeTop Mount
Width1.063" (27.00mm)
Package CooledBGA
Attachment MethodAdhesive
Power Dissipation @ Temperature Rise6.8W @ 75°C
Thermal Resistance @ Forced Air Flow4.50°C/W @ 200 LFM
Thermal Resistance @ Natural11.11°C/W
Fin Height0.709" (18.00mm)
Material FinishBlack Anodized

Panasonic Electronic Components
RES SMD 1.1K OHM 5% 1/8W 0805
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RES SMD 2.4K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES SMD 1.5K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES SMD 3K OHM 5% 1/8W 0805
Roving Networks (Microchip Technology)
IC EEPROM 1KBIT MICROWIRE 8SOIC
Omron Electronic Components
SENSOR OPT REFLECTIVE 5MM 5DIP
Sullins Connector Solutions
CONN HEADER VERT 1POS
Sullins Connector Solutions
CONN HEADER VERT 1POS
Sullins Connector Solutions
CONN HEADER VERT 2POS
Sullins Connector Solutions
CONN HEADER R/A 2POS
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