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HW-03-09-F-S-355-SM-A

Part number HW-03-09-F-S-355-SM-A
Product classification Board Spacers, Stackers (Board to Board)
Manufacturer Samtec, Inc.
Description HIGH TEMPERATURE FLEXIBLE BOARD
Encapsulation
Packing Bulk
Quantity 0
RoHS status YES
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$1.5750

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TYPEDESCRIPTION
MfrSamtec, Inc.
SeriesFlex Stack, HW
PackageBulk
Product StatusACTIVE
ColorBlack, Natural
Mounting TypeSurface Mount
Pitch0.100" (2.54mm)
TerminationSolder
Contact Finish - Post (Mating)Gold
Contact Finish Thickness - Post (Mating)3.00µin (0.076µm)
Number of Rows1
Number of Positions3
Length - Overall Pin0.665" (16.891mm)
Length - Post (Mating)0.310" (7.874mm)
Length - Stack Height0.355" (9.017mm)

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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