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IW-HSKALU-CLASLR-Q703

Part number IW-HSKALU-CLASLR-Q703
Product classification Heat Sinks
Manufacturer iWave Systems
Description I.MX 6 DL/S QSEVEN SOM HEATSINK
Encapsulation
Packing Bulk
Quantity 2
RoHS status YES
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$33.2850

$33.2850

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Product parameters
TYPEDESCRIPTION
MfriWave Systems
Series-
PackageBulk
Product StatusACTIVE
MaterialAluminum
Length2.756" (70.00mm)
ShapeRectangular, Fins
TypeTop Mount
Width2.480" (62.99mm)
Package CooledCPU
Attachment MethodBolt On
Fin Height0.670" (17.00mm)

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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