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MSDV-2008-AKA0T01

Part number MSDV-2008-AKA0T01
Product classification PC Card Sockets
Manufacturer ACES GROUP
Description MICRO SD CARD CONN. VERTICAL DIP
Encapsulation
Packing Tray
Quantity 0
RoHS status YES
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Inventory:
Total number

Quantity

Price

Total price

1

$2.1735

$2.1735

10

$1.8900

$18.9000

25

$1.8165

$45.4125

40

$1.7745

$70.9800

80

$1.6905

$135.2400

230

$1.5330

$352.5900

440

$1.4070

$619.0800

945

$1.2075

$1,141.0875

2400

$1.1235

$2,696.4000

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Product parameters
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TYPEDESCRIPTION
MfrACES GROUP
Series-
PackageTray
Product StatusACTIVE
Connector TypeConnector and Ejector
Contact FinishGold
Mounting TypeThrough Hole
Number of Positions8
Card TypemicroSD™
Height Above Board0.558" (14.18mm)
Contact Finish Thickness12.0µin (0.30µm)
Mounting FeatureNormal, Standard - Top
Insertion, Removal MethodPush In, Pull Out

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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