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N700C-80-80-1.5

Part number N700C-80-80-1.5
Product classification Pads, Sheets
Manufacturer Shiu Li Technology
Description NON-SILICONE THERMAL CONDUCTIVE
Encapsulation
Packing Bag
Quantity 42
RoHS status YES
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Inventory:
Total number

Quantity

Price

Total price

1

$24.0660

$24.0660

10

$22.7325

$227.3250

25

$21.3990

$534.9750

50

$20.0550

$1,002.7500

100

$18.7215

$1,872.1500

250

$17.3880

$4,347.0000

500

$17.0520

$8,526.0000

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Product parameters
PDF(1)
TYPEDESCRIPTION
MfrShiu Li Technology
SeriesN700C
PackageBag
Product StatusACTIVE
ColorGray
MaterialNon-Silicone
ShapeSquare
Thickness0.059" (1.50mm)
TypeConductive Pad, Sheet
Outline80.00mm x 80.00mm
Thermal Conductivity5.0W/m-K
AdhesiveTacky - Both Sides
Shelf Life StartDate of Shipment
Shelf Life60 Months

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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