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P-BNP-AC-0416-3C

Part number P-BNP-AC-0416-3C
Product classification 3D Printing Accessories
Manufacturer Slice Engineering
Description Boron Nitride Paste 30 cc
Encapsulation
Packing Retail Package
Quantity 48
RoHS status YES
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Inventory:
Total number

Quantity

Price

Total price

1

$68.2500

$68.2500

5

$65.1000

$325.5000

10

$60.9000

$609.0000

20

$56.7000

$1,134.0000

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Product parameters
TYPEDESCRIPTION
MfrSlice Engineering
Series-
PackageRetail Package
Product StatusACTIVE
For Use With/Related ProductsFDM/FFF 3D Printers
TypeBoron Nitride Thermal Paste

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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