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SMDLTLFP500T5C

Part number SMDLTLFP500T5C
Product classification Solder
Manufacturer Chip Quik, Inc.
Description SOLDER PASTE LOW TEMP T5 500G
Encapsulation
Packing Bulk
Quantity 0
RoHS status YES
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$220.5000

$220.5000

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TYPEDESCRIPTION
MfrChip Quik, Inc.
Series-
PackageBulk
Product StatusACTIVE
CompositionBi57.6Sn42Ag0.4 (57.6/42/0.4)
TypeSolder Paste
Melting Point281°F (138°C)
FormCartridge, 17.64 oz (500g)
Mesh Type5
ProcessLead Free
Flux TypeNo-Clean
Storage/Refrigeration Temperature37°F ~ 46°F (3°C ~ 8°C)
Shelf Life StartDate of Manufacture
Shelf Life6 Months

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