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STV-BB03

Part number STV-BB03
Product classification Embedded Computer Interface Boards
Manufacturer Diamond Systems
Description STEVIE CARR JETSON AGX XAVIER LC
Encapsulation
Packing Bulk
Quantity 77
RoHS status YES
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Total number

Quantity

Price

Total price

1

$845.2500

$845.2500

5

$768.6000

$3,843.0000

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Product parameters
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TYPEDESCRIPTION
MfrDiamond Systems
SeriesSTEVIE
PackageBulk
Product StatusACTIVE
Size / Dimension4.173" x 3.622" (106.00mm x 92.00mm)
FunctionA/D and D/A
Operating Temperature-40°C ~ 85°C
Form FactorM.2 2230
Expansion Site/BusPCIe
Video OutputsHDMI
EthernetGbE (1)
USBUSB 2.0 (2), USB 3.1 (2)
RS-232 (422, 485)2
Watchdog TimerNo

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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