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T-WORK9000-80-80-2.5

Part number T-WORK9000-80-80-2.5
Product classification Pads, Sheets
Manufacturer Shiu Li Technology
Description HIGH THERMAL CONDUCTIVE PAD, 80M
Encapsulation
Packing Tray
Quantity 91
RoHS status YES
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Inventory:
Total number

Quantity

Price

Total price

1

$156.7860

$156.7860

16

$146.9895

$2,351.8320

32

$137.1825

$4,389.8400

48

$132.2895

$6,349.8960

80

$127.3860

$10,190.8800

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Product parameters
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TYPEDESCRIPTION
MfrShiu Li Technology
SeriesT-work9000
PackageTray
Product StatusACTIVE
ColorBrown
MaterialSilicone
ShapeSquare
Thickness0.0980" (2.489mm)
TypeGap Filler Pad, Sheet
UsageThermally Conductive
Outline80.00mm x 80.00mm
Thermal Conductivity20W/m-K
AdhesiveTacky - Both Sides

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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