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T3P26FC1LY

Part number T3P26FC1LY
Product classification Multi Purpose
Manufacturer VEAM (ITT Cannon)
Description TRIDENT
Encapsulation
Packing Bulk
Quantity 4899
RoHS status YES
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Inventory:
Total number

Quantity

Price

Total price

1

$2.9715

$2.9715

10

$2.6985

$26.9850

100

$2.3730

$237.3000

1000

$1.7220

$1,722.0000

5000

$1.5435

$7,717.5000

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Product parameters
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TYPEDESCRIPTION
MfrVEAM (ITT Cannon)
SeriesTrident T3P
PackageBulk
Product StatusACTIVE
Contact FinishGold
Contact TerminationCrimp
Wire Gauge26 AWG
TypeMachined
Pin or SocketSocket
Contact Finish Thickness30.0µin (0.76µm)
Contact MaterialBrass

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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