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TBV17-14 PLAIN

Part number TBV17-14 PLAIN
Product classification Box Components
Manufacturer LMB Heeger, Inc.
Description UNI-PAK PANEL VENT 8.75X13.875 B
Encapsulation
Packing Bulk
Quantity 0
RoHS status YES
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$52.2585

$52.2585

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Product parameters
TYPEDESCRIPTION
MfrLMB Heeger, Inc.
SeriesUni-Pac
PackageBulk
Product StatusACTIVE
FeaturesVented
ColorUnpainted
Size / Dimension8.750" L x 13.875" W x 0.063" H (222.25mm x 352.43mm x 1.60mm)
For Use With/Related ProductsUni-Pac Series
MaterialMetal, Aluminum
TypePanel, Top

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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