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TH235-2-500G-JAR

Part number： TH235-2-500G-JAR
Product classification： Adhesives, Epoxies, Greases, Pastes
Manufacturer： Penchem Technologies Sdn Bhd
Description： NON SILICONE THERMAL PUTTY
Encapsulation：
Packing： Bottle
Quantity： 6
RoHS status： YES
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$88.1685

$88.1685

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TYPEDESCRIPTION
MfrPenchem Technologies Sdn Bhd
SeriesTH235-2
PackageBottle
Product StatusACTIVE
ColorBlue
Size / Dimension500 gram Container
TypeNon-Silicone Putty
Thermal Conductivity4.00W/m-K
Shelf Life18 Months
Usable Temperature Range5°F ~ 248°F (-15°C ~ 200°C)

Roving Networks (Microchip Technology)
DSC1001DI1-133.0000T
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
DSC1001BL5-024.5760T
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
DSC1122BI1-100.0000T
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
DSC1122AI1-125.0000T
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
DSC6001JE1B-052.0000T
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
DSC1001BI5-133.3330T
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
DSC1123CI2-175.0000T
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
DSC1123DI1-125.0000T
MEMS OSC LOW JITTER 125MHZ LVDS
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