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TH994LH_288_192_1.5

Part number TH994LH_288_192_1.5
Product classification Pads, Sheets
Manufacturer Penchem Technologies Sdn Bhd
Description Soft Silicone Thermal Pad
Encapsulation
Packing Sheet
Quantity 20
RoHS status YES
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$61.9500

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Product parameters
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TYPEDESCRIPTION
MfrPenchem Technologies Sdn Bhd
SeriesTH994LH
PackageSheet
Product StatusACTIVE
ColorGray
MaterialSilicone
Thermal Conductivity6.0W/m-K
Shelf Life12 Months

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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