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TH997-288-192-2.5

Part number TH997-288-192-2.5
Product classification Pads, Sheets
Manufacturer Penchem Technologies Sdn Bhd
Description THERM PAD 288MMX192MM BLUE
Encapsulation
Packing Sheet
Quantity 20
RoHS status YES
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$23.9400

$23.9400

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TYPEDESCRIPTION
MfrPenchem Technologies Sdn Bhd
SeriesTH997
PackageSheet
Product StatusACTIVE
ColorBlue
MaterialSilicone
ShapeRectangular
Thickness0.0984" (2.500mm)
TypeGap Filler Pad, Sheet
UsageThermally Conductive
Outline288.00mm x 192.00mm
Thermal Conductivity2.4W/m-K
AdhesiveTacky - Both Sides

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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