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TW-T200-01-10

Part number TW-T200-01-10
Product classification Pads, Sheets
Manufacturer 3G Shielding Specialties
Description THERM PAD 300MMX200MM BLUE
Encapsulation
Packing Sheet
Quantity 8
RoHS status YES
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Inventory:
Total number

Quantity

Price

Total price

1

$57.7500

$57.7500

5

$52.5000

$262.5000

10

$47.2500

$472.5000

20

$42.0000

$840.0000

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Product parameters
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TYPEDESCRIPTION
Mfr3G Shielding Specialties
Series-
PackageSheet
Product StatusACTIVE
ColorBlue
MaterialSilicone Elastomer
Thickness0.0394" (1.000mm)
TypeGap Filler Pad, Sheet
UsageMulti
Outline300.00mm x 200.00mm
Thermal Conductivity2.0W/m-K
Backing, CarrierFiberglass

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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