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ZSSC3123AI6C

Part number ZSSC3123AI6C
Product classification Sensor and Detector Interfaces
Manufacturer Intersil (Renesas Electronics Corporation)
Description DICE (WAFER SAWN) - FRAME
Encapsulation
Packing Tray
Quantity 0
RoHS status YES
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Price

Total price

9464

$1.7640

$16,694.4960

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Product parameters
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TYPEDESCRIPTION
MfrIntersil (Renesas Electronics Corporation)
SeriescLite™
PackageTray
Product StatusACTIVE
Package / CaseDie
Output TypeI2C, SPI
Mounting TypeSurface Mount
TypeCapacitive Sensor
Operating Temperature-40°C ~ 85°C (TA)
Input TypeCapacitive
Supplier Device PackageDie
Current - Supply1.1 mA

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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