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00274

零件编号 00274
产品分类 化学品、清洁剂
制造商 3M
描述 BONDO GLASS REINFORCED FILLER GA
封装
包装 散装
数量 0
RoHS 状态 NO
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库存:
总数

数量

价格

总价

4

$76.8810

$307.5240

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产品参数
PDF(1)
类型描述
制造商3M
系列-
包装散装
产品状态ACTIVE
类型Resin
尺寸1 gal
应用领域General Purpose

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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