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A18145-02

零件编号 A18145-02
产品分类 垫、床单
制造商 Laird Technologies - Thermal Materials
描述 THERM PAD 228.6MMX228.6MM GRAY
封装
包装 散装
数量 73
RoHS 状态 YES
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库存:
总数

数量

价格

总价

1

$17.1990

$17.1990

10

$16.2435

$162.4350

100

$13.3770

$1,337.7000

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产品参数
PDF(1)
类型描述
制造商Laird Technologies - Thermal Materials
系列Tflex™ RB300
包裹散装
产品状态ACTIVE
颜色Gray
材料Silicone, Ceramic Filled
形状Square
厚度0.0200" (0.508mm)
类型Gap Filler Pad, Sheet
大纲228.60mm x 228.60mm
导热系数1.2W/m-K
粘合剂Tacky - Both Sides

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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