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ATS-PCBM1101

零件编号 ATS-PCBM1101
产品分类 散热片
制造商 Advanced Thermal Solutions, Inc.
描述 BOARD LEVEL HEAT SINK
封装
包装 散装
数量 0
RoHS 状态 YES
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库存:
总数

数量

价格

总价

500

$1.7745

$887.2500

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产品参数
类型描述
制造商Advanced Thermal Solutions, Inc.
系列-
包装散装
产品状态ACTIVE
材料Aluminum
长度2.000" (50.80mm)
形状Rectangular, Fins
类型Board Level, Vertical
宽度1.650" (41.91mm)
封装冷却TO-218, TO-220, TO-247
安装方法Bolt On and PC Pin
热阻@强制气流2.50°C/W @ 200 LFM
热阻@自然3.50°C/W
翅片高度1.000" (25.40mm)
材料表面处理Black Anodized

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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