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FE0370FR3BLK

零件编号 FE0370FR3BLK
产品分类 骨架(线圈架)、安装座、硬件
制造商 Miles Platts
描述 Bobbin E65/32/27 V 0P 2x Stack
封装
包装 散装
数量 192
RoHS 状态 YES
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库存:
总数

数量

价格

总价

1

$2.6880

$2.6880

5

$2.3205

$11.6025

10

$2.2890

$22.8900

25

$1.9530

$48.8250

50

$1.8480

$92.4000

100

$1.6380

$163.8000

200

$1.5855

$317.1000

500

$1.3755

$687.7500

1000

$1.3230

$1,323.0000

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产品参数
PDF(1)
类型描述
制造商Miles Platts
系列E65/32/27 Double
包裹散装
产品状态ACTIVE
与/相关产品一起使用E
配件类型Bobbin (Coil Former), Vertical
供应商设备包E 65 x 32 x 27

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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