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HBA25031-10/CU/Y

零件编号 HBA25031-10/CU/Y
产品分类 散热片
制造商 Malico
描述 CU HEAT SINK 25X25X10MM WITH LIN
封装
包装 托盘
数量 78
RoHS 状态 YES
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库存:
总数

数量

价格

总价

1

$5.4390

$5.4390

10

$5.3025

$53.0250

25

$5.1555

$128.8875

50

$4.8720

$243.6000

100

$4.5780

$457.8000

250

$4.2945

$1,073.6250

450

$4.1475

$1,866.3750

950

$3.7275

$3,541.1250

获取报价信息
产品参数
类型描述
制造商Malico
系列HBA
包装托盘
产品状态ACTIVE
材料Copper
长度0.984" (25.00mm)
形状Square, Fins
类型Top Mount
宽度0.984" (25.00mm)
封装冷却BGA
安装方法Clip
翅片高度0.307" (7.80mm)

Panasonic Electronic Components
RES SMD 1.1K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES SMD 2.4K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES SMD 1.5K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES SMD 3K OHM 5% 1/8W 0805
Roving Networks (Microchip Technology)
IC EEPROM 1KBIT MICROWIRE 8SOIC
Omron Electronic Components
SENSOR OPT REFLECTIVE 5MM 5DIP
Sullins Connector Solutions
CONN HEADER VERT 1POS
Sullins Connector Solutions
CONN HEADER VERT 1POS
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