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HBA27031-06/CU/BU

零件编号 HBA27031-06/CU/BU
产品分类 散热片
制造商 Malico
描述 CU HEAT SINK 27X27X6MM WITH LINE
封装
包装 托盘
数量 547
RoHS 状态 YES
分享
库存:
总数

数量

价格

总价

1

$5.4390

$5.4390

10

$5.3025

$53.0250

25

$5.1555

$128.8875

50

$4.8720

$243.6000

100

$4.5780

$457.8000

250

$4.2945

$1,073.6250

450

$4.1475

$1,866.3750

950

$3.7275

$3,541.1250

获取报价信息
产品参数
类型描述
制造商Malico
系列HBA
包装托盘
产品状态ACTIVE
材料Copper
长度1.063" (27.00mm)
形状Square, Fins
类型Top Mount
宽度1.063" (27.00mm)
封装冷却BGA
安装方法Clip
翅片高度0181" (4.60mm)

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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