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HSB19-272718

零件编号 HSB19-272718
产品分类 散热片
制造商 CUI Devices
描述 HEAT SINK, BGA, 27 X 27 X 18 MM
封装
包装 盒子
数量 20
RoHS 状态 YES
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库存:
总数

数量

价格

总价

1

$2.0265

$2.0265

10

$1.9215

$19.2150

25

$1.8690

$46.7250

50

$1.8165

$90.8250

100

$1.7220

$172.2000

250

$1.6170

$404.2500

500

$1.5120

$756.0000

1000

$1.4175

$1,417.5000

5000

$1.3650

$6,825.0000

获取报价信息
产品参数
PDF(1)
类型描述
制造商CUI Devices
系列HSB
包装盒子
产品状态ACTIVE
材料Aluminum Alloy
长度1.063" (27.00mm)
形状Square, Pin Fins
类型Top Mount
宽度1.063" (27.00mm)
封装冷却BGA
安装方法Adhesive
温升时的功耗6.8W @ 75°C
热阻@强制气流4.50°C/W @ 200 LFM
热阻@自然11.11°C/W
翅片高度0.709" (18.00mm)
材料表面处理Black Anodized

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