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IW-HSKALU-CLASLR-Q703

零件编号 IW-HSKALU-CLASLR-Q703
产品分类 散热片
制造商 iWave Systems
描述 I.MX 6 DL/S QSEVEN SOM HEATSINK
封装
包装 散装
数量 2
RoHS 状态 YES
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总数

数量

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$33.2850

$33.2850

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产品参数
类型描述
制造商iWave Systems
系列-
包装散装
产品状态ACTIVE
材料Aluminum
长度2.756" (70.00mm)
形状Rectangular, Fins
类型Top Mount
宽度2.480" (62.99mm)
封装冷却CPU
安装方法Bolt On
翅片高度0.670" (17.00mm)

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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