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PH-GC-02-I

零件编号 PH-GC-02-I
产品分类 垫、床单
制造商 GELID SOLUTIONS
描述 THERMAL PAD FOR CPU
封装
包装 零售包装
数量 24
RoHS 状态 YES
分享
库存:
总数

数量

价格

总价

1

$7.4655

$7.4655

10

$7.1295

$71.2950

25

$6.6990

$167.4750

50

$6.4470

$322.3500

100

$5.9430

$594.3000

250

$5.5545

$1,388.6250

500

$5.4705

$2,735.2500

1000

$5.4285

$5,428.5000

获取报价信息
产品参数
PDF(1)
类型描述
制造商GELID SOLUTIONS
系列-
包裹零售包装
产品状态ACTIVE
形状Rectangular
厚度0.0079" (0.200mm)
类型Phase Change Pad, Sheet
用法CPU
大纲40.00mm x 30.00mm
导热系数8.5W/m-K

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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