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TH833-3_0.5_0.5

零件编号 TH833-3_0.5_0.5
产品分类 粘合剂、环氧树脂、油脂、糊剂
制造商 Penchem Technologies Sdn Bhd
描述 Silicone thermal conductive pott
封装
包装 瓶子
数量 19
RoHS 状态 YES
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$157.5000

$157.5000

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产品参数
PDF(1)
类型描述
制造商Penchem Technologies Sdn Bhd
系列TH833-3
包装瓶子
产品状态ACTIVE
颜色Gray, White
尺寸/尺寸500 gram Jar
类型Silicone Compound, 2 Part
导热系数2.0W/m-K
保质期开始Date of Manufacture
保质期12 Months
使用温度范围-40°F ~ 392°F (-40°C ~ 200°C)

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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